Paper
Code
STP-784
WB-8-2-INV

Abstract: Transient Liquid Assisted Growth (TLAG), A Method for Increasing Coated Conductors Throughput and Meeting Future

Volume Number:
18
Issue Number:
56
Publication Date:
Publication Date
September 2024
Author(s)
T. Puig, R. Vlad, L. Saltarelli, D. Garcia, K. Gupta, C. Torres, A. Kethamkuzhi, E. Pach, C.Pop, D. Sanchez, S. Rasi, J. Banchewski, A. Queralto, S. Ricart, R. Yanez, J. Farjas, J. Gutierrez, C. Mocuta, E. Solano, and X. Obradors